To solve this, we designed a fully automated optomechanical transfer system. Instead of relying on slower, error-prone manual methods, this hardware uses continuous feedback to mechanically position and place fragile 2D materials onto wafer substrates with strictly submicron precision. The system was engineered to actively isolate vibrations and manage thermal drift to prevent any material damage during the transfer step. The device was a step between lab-scale physics and commercial fabrication, enabling highly repeatable, high-yield production of advanced AI components that met industry manufacturing standards.