To overcome these alignment tolerances, we developed a custom, ultra-high-resolution pick-and-place system designed for sub-micron manipulation. The architecture utilizes a high-precision motion stage capable of positioning components with a resolution of several hundred nanometers. Rather than using standard adhesives, the system places the RGB lasers directly onto a specialized, pre-patterned soldering paste. By precisely controlling the thermal profile of the substrate, we trigger a laser soldering process that locks the diodes into place exactly where they interface with the waveguides. This approach successfully eliminated the need for external fiber coupling, drastically reducing the total packaging footprint while ensuring the stable and efficient optical coupling required for high-density semiconductor applications.